2009年11月25日星期三

Measurement of bonding strength

•Wire Pull Testing (WPT), or bond pull testing, is one of several available time-zero tests for wire bond strength and quality. It consists of applying an upward force under the wire to be tested, effectively pulling the wire away from the die.


•Wire pull testing requires a special equipment commonly referred to as a wire pull tester (or bond pull tester), which consists of two major parts:
(1) a mechanism for applying the upward pulling force on the wire using a tool known as a pull hook;
(2) a calibrated instrument for measuring the force at which the wire eventually breaks. This breaking force is usually expressed in grams-force.


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